We develop and manufacture vacuum tight housings with top performance for chips of diamater ranging from 1 to 6 inches. The assemblies contain hard brazed joints of Al2O3 ceramic rings to a variety of metals including FeNi alloys and oxygen free copper. 100% of them are leak tested by helium ensuring 10-8 mbarL/s hermeticity readings.
The products guaranteeing maximum parallelity of contact faces in assemblies in the range of micrometers provide an optimal transfer of energy. In order to achieve maximum voltage the surface pathways and distances we are developed for concrete individual applications. The housings and lids are surface treated/nickel plated on a fully automatic line.